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April 2025
The global electronic adhesives market size accounted for USD 5.79 billion in 2024 and is predicted to increase from USD 6.32 billion in 2025 to approximately USD 14.01 billion by 2034, expanding at a CAGR of 9.24% from 2025 to 2034. The advancements in electronic components and need for stronger adhesives solution that suitable for lightweight and smaller devices is likely to drive the growth of the market.
The electronic adhesives market has witnessed steady growth in the recent period. The need for high-performance bonding solutions for electronics items has led to market growth over the period. Moreover, advancements in electronic components and miniaturization technologies often contribute to the growth of the market. Individuals are actively looking for lighter, smaller, and more cost-effective electronic devices in the current period. Thus, these adhesives play a crucial role in the making of the device by providing flexibility, durability, and enhanced conductivity in the electronic industry.
The ongoing technological advancement is expected to drive industry growth during the coming years, as advancements such as 5G technology, adoption of the Internet of Things (IoT), and wearable electronics can increase the need for electronic devices. These devices require adhesives that can adopt extreme temperatures and high frequencies. Electronic adhesives are likely to rise as the key solutions for these types of devices during the forecast period. Furthermore, the electrical vehicle industry is likely to boost the sales of electronic adhesives by increasing their use in vehicle batteries and printed circuit board applications.
| Report Metric | Details |
| Market Size in 2025 | USD 6.32 Billion |
| Expected Market Size in 2034 | USD 14.01 Billion |
| Growth Rate | CAGR of 9.24% from 2025 to 2034 |
| Base Year for Estimation | 2024 |
| Forecast Period | 2025-2034 |
| Dominant Region | Asia Pacific |
| Segment Covered | By Form,Type,Application,Region |
| Key Companies Profile | 3M Company, Alent PLC, BASF SE, H.B. Fuller Company, Henkel AG & Co. KGaA, Indium Corporation, LG Chemical Limited, The Dow Chemicals Company, Dymax Corporation, Hitachi Chemical Co |
The expansion and development of wearable technology and flexible electronics are expected to create lucrative opportunities for the electronic adhesives market. The development of devices such as medical wearables, smartwatches, and foldable smartphones require advanced adhesives that provide durability and flexibility in the coming years. Moreover, growing dependency on health monitoring devices can lead to market growth during the forecast period as advanced electronic adhesives manufacturers can fulfill these requirements by making stronger adhesives in the future.
The rules and regulations towards sustainability and environment-friendly initiatives can hamper market growth in the coming period. Many traditional adhesives include hazardous chemicals that can create carbon emissions and lead to risks for the environment. As a result, manufacturers are under pressure to reduce waste and make sustainable adhesives. Also, the creation of sustainable adhesives needs a higher cost than traditional adhesives, which can create further challenges for the adhesive’s producer in the future.
Asia Pacific dominated the electronic adhesives market in 2024. The factors such as the large electronic manufacturing sector, the need for advanced technologies, and a strong raw material supply are leading to market growth in the region. Countries like China, Japan, and India are considered potential tech hubs globally. These countries are also the world's leading semiconductor manufacturers in the current period. Also, technological developments are contributing to major market share in the Asia Pacific in the current period.
China Dominates the Adhesive Market with Manufacturing Strength.The presence of large manufacturing brands and support from the government for manufacturing initiatives maintained a leading position of China in the region in 2024. The heavy demand for displays, semiconductor packaging, and circuit boards has been seen in China in recent years. Initiatives such as Made In China 2025 and others have created a favorable environment for the electronic adhesive manufacturers in the country. Moreover, a growing focus on technological advances like 5G technology and others is expected to contribute heavily to sales of electronic adhesives in the country.
North America expects the fastest growth in the market during the forecast period. The technological advances and increased need for high-performance adhesives can lead to market potential in the upcoming period. The region has a great and developed infrastructure for electronic production initiatives, which ensures high-end manufacturing standards of electronic adhesives in the region during the
Future of Electronic Adhesives Shaped in the United States.United States is anticipated to rise as a country to produce advanced electronic adhesives in the coming period. Modern research institutes and tech hubs such as Silicon Valley are trying to push boundaries for electronic manufacturing in the country nowadays. Furthermore, the aerospace and defense industry will gain substantial market share akin to ongoing advancements in military-grade electronics and specialized devices in the country in upcoming years.
The liquid segment held the dominating share of the electrical adhesives market in 2024. The liquid adhesions are utilized in multiple applications, including bonding electronic components for printing circuit boards. Liquid adhesive plays a crucial role in protecting form moisture and environment factors by sealing them, thereby enhancing their reliability and providing encapsulation. The market includes several types of electronic adhesive, for example, silicone adhesive, epoxy adhesive, and polyurethane adhesive, among others. The choice of adhesive is often based on their different properties and the requirement of the application.
The solid segment is expected to experience significant electronic adhesives market growth during the forecast period. The segment is used different applications. The solid adhesive comes in the form of sticks, such as pellets, hot glue gun sticks, or cartridges. That is in high demand to make the adhesive very clean and easy to store and handle.
The thermally conducive segment led the electronic adhesives market in 2024. The segment is in large demand for effectively managing heat. Advanced technologies like microelectronic devices and EV batteries need to manage heat and prevent it from causing performance problems and other substantial issues. It's available in various types in the market like films, glues help to bond heat- generating components to heat sinks.
The electrically conducive segment observes notable growth during the forecast period. The segment works its way into various fields of electronic manufacturing. The electrical industry trend toward lighter and more flexible electronics, the electrically conducive is expected to rise as a key solution for electric manufacturers. To avoid rigid connections, electrically conductive is used as the alternative for traditional soldering methods for flexible circuits. The electrically conducive utilized in categories like conductive and
The integrated circuits segment held the largest share of the electronic adhesives market in 2024. The enlarged demand for high-performance electronic devices and miniaturized devices is leading to segment growth in the current period. Also, integrated circuits have become the key factor for all modern devices, such as computers, smartphones, and others. This versatility is driving the growth of the segment in the current phase.
The semiconductor segment expects significant growth in the market during the forecast period. The expansion of advanced technologies such as 5G and IoT application is likely to contribute significantly to segment growth during the forecast period. to the development of higher 5G connectivity, manufacturers are seeking specialized semiconductor chips with specialized adhesives that have reliable bonding and insulation properties.
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